HDI Flex Cutting, Hole and via Drilling, Selective Polyimide Removal is defined as spaces and traces in the less than 200um ranges and 250um or less for vias. Used primarily in telecom, computer, IC manufacturing and medical devices. Our laser is tuned to be the most efficient cut on polyimide for flex processing. Less debris, faster cutting speed and better quality of cut are compared with non polyimide-tuned lasers.

Polyimides have found many applications in different industries such as electronics, medical, aerospace in addition to numerous applications in commercial goods. Unique properties of Polyimides such as high working temperature, resistance to radiation, low flammability and smoke emission, wear resistance, good dielectric properties, and chemical stability make them materials of choice for design engineers. Polyimides such as Kapton, Vespel, Upilex, Kinel and Robon are available commercially in sheets, film, tube or rod shapes.

Major applications include multilayer thin metal/dielectric "sandwiches" for flexible circuits used in the electronics industry, small parts for medical applications, ink jet printer heads, flow devices, drug delivery systems, and masks.

Most of these applications require precise machining using various technologies. Machining of holes, slots, cutting of small parts from polyimide or multilayer films has always been the application of choice for conventional laser cutting using Carbon Dioxide lasers. A highly concentrated laser beam delivers heat energy to a desired location thereby raising the temperature on the workpiece and "cutting" through the material. The melting/evaporation technique is suitable for low end applications when edge quality is not a concern. New requirements for miniaturization in all industries bring the need for greater precision in the machining process.

The above pictures demonstrate the machining polyimides for flexcircuits using a traditional Carbon Dioxide laser. The process is dry and non-contact yielding 100% in part production. The smallest feature that can be produced is .001" in size with an accuracy of placement of .0005" within a 12" square work area.